US Patent Issued to STATS ChipPAC on March 17 for "Semiconductor device and method of making a semiconductor package with graphene-coated interconnects" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,974, issued on March 17, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of making a semiconductor package with graphene-coated interconnects" was invented by YongMoo Shin (Incheon, South Korea), HeeSoo Lee (Incheon, South Korea) and EunHee Myung (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first substrate and a second substrate. A graphene-coated interconnect is disposed between the first substrate and second substrate. A semiconductor die is disposed between the first substrate and second substrate. The first substrate is electrically coupled to th...