US Patent Issued to STATS ChipPAC on June 9 for "Semiconductor manufacturing equipment and method of expelling residue through suction hood" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,982, issued on June 9, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor manufacturing equipment and method of expelling residue through suction hood" was invented by ChangOh Kim (Incheon, South Korea), JinHee Jung (Incheon, South Korea), YuJeong Jang (Incheon, South Korea) and JiWon Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing equipment has a support platform and a substrate disposed over the support platform. A first electrical component is disposed over a first surface of the substrate. A second electrical component is disposed over a second surface of the substrate opposite...