US Patent Issued to STATS ChipPAC on Feb. 24 for "Semiconductor device and method of forming graphene core shell embedded within shielding layer" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,059, issued on Feb. 24, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming graphene core shell embedded within shielding layer" was invented by YongMoo Shin (Incheon, South Korea) and SuJeong Kwon (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and an electrical component disposed over the substrate. An encapsulant is deposited over the electrical component and substrate. A shielding layer has a graphene core shell formed on a surface of the encapsulant. The shielding layer can be printed on the encapsulant. The graphene core shell includes a co...