US Patent Issued to STATS ChipPAC on Aug. 11 for "Semiconductor device and method of forming shielding material containing conductive spheres" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,981, issued on Aug. 11, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming shielding material containing conductive spheres" was invented by JinHee Jung (Incheon, South Korea) and ChangOh Kim (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and an electrical component disposed over the substrate. An encapsulant is deposited over the electrical component and substrate. A shielding material, containing a plurality of spheres embedded in a matrix, is formed on the encapsulant. The shielding material 144 can be formed by spray coating, printing, liqu...