US Patent Issued to STATS ChipPAC on April 21 for "Semiconductor device and method of making a dual-side molded system-in-package with fine-pitched interconnects" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,851, issued on April 21, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of making a dual-side molded system-in-package with fine-pitched interconnects" was invented by YongMoo Shin (Incheon, South Korea), SeongKuk Kim (Gyeonggi-do, South Korea), SinJae Kim (Incheon, South Korea) and SeokBeom Heo (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate. An electrical component is disposed over a first surface of the substrate. A solder paste is disposed over the first surface of the substrate. A conductive pillar is disposed on the solder paste. An encapsulant ...