US Patent Issued to Sony Semiconductor Solutions on Sept. 22 for "Solid-state imaging element and imaging system" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,469, issued on Sept. 22, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging element and imaging system" was invented by Makoto Nakamura (Nagasaki, Japan), Shin Kitano (Kanagawa, Japan), Yusuke Murakawa (Nagasaki, Japan), Koya Tsuchimoto (Nagasaki, Japan), Takuya Hanada (Nagasaki, Japan) and Yuki Noda (Nagasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging element according to the present disclosure is provided with a first substrate (light reception chip) and a second substrate (detection chip). The first substrate (light reception chip) is provided with a photodiode that photoel...