US Patent Issued to Sony Semiconductor Solutions on Sept. 15 for "Semiconductor chip and manufacturing method therefor, semiconductor device and manufacturing method therefor, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,169, issued on Sept. 15, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor chip and manufacturing method therefor, semiconductor device and manufacturing method therefor, and electronic device" was invented by Naoki Komai (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present technology relates to a semiconductor chip of an imaging element, a method of manufacturing the semiconductor chip, a semiconductor device, a method of manufacturing the semiconductor device, and an electronic device, which are capable of suppressing image quality deterioration of a captured image while securing long-term...