US Patent Issued to Sony Semiconductor Solutions on Nov. 3 for "Sensor device with improved heat dissipation" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,776, issued on Nov. 3, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Sensor device with improved heat dissipation" was invented by Kenichi Taguchi (Kumamoto, Japan) and Takahiro Wakabayashi (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor device according to the present disclosure includes: a Peltier element; a sensor element thermally connected to a cooling surface of the Peltier element; and a package substrate that is thermally connected to a heat dissipation surface of the Peltier element and accommodates the Peltier element and the sensor element. In addition, the package substrate has a heat diss...