US Patent Issued to Sony Semiconductor Solutions on Nov. 3 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,465, issued on Nov. 3, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor device" was invented by Mitsuru Adachi (Kanagawa, Japan), Toshihiro Murayama (Kanagawa, Japan), Ryo Inomoto (Gifu, Japan), Hirohisa Yasukawa (Kanagawa, Japan), Yuki Suda (Kanagawa, Japan), Masaki Hatano (Kanagawa, Japan), Toshiki Koyama (Kanagawa, Japan), Harumi Miyaki (Kanagawa, Japan) and Kiyohisa Sakai (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Reliability is improved in a semiconductor device using a heat conductive member. The semiconductor device includes a first semiconductor chip, a heat dissipation member, a heat c...