US Patent Issued to Sony Semiconductor Solutions on March 24 for "Solid-state imaging apparatus, method for manufacturing solid-state imaging apparatus, and electronic apparatus" (Japanese Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,309, issued on March 24, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging apparatus, method for manufacturing solid-state imaging apparatus, and electronic apparatus" was invented by Tomohiko Baba (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a solid-state imaging apparatus that allows to suitably dispose a translucent member on a substrate including a photoelectric conversion portion. The solid-state imaging apparatus of the present disclosure has: a substrate that includes a photoelectric conversion portion; a lens that is disposed on the substrate; and a translucent me...