US Patent Issued to Sony Semiconductor Solutions on June 30 for "Solid state imaging device and manufacturing method, and electronic apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. RE50,941, issued on June 30, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid state imaging device and manufacturing method, and electronic apparatus" was invented by Hiroaki Seko (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid state imaging device includes a substrate, in which the substrate includes a photoelectric conversion unit that generates a charge according to a light amount of incident light by a pixel unit, an accumulation unit that divides the charge of the pixel unit which is generated in the photoelectric conversion unit and accumulates the charge, a first element isolation unit that is form...