US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on June 30 for "Semiconductor device, method for manufacturing semiconductor device, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,365, issued on June 30, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor device, method for manufacturing semiconductor device, and electronic device" was invented by Suguru Saito (Kanagawa, Japan) and Nobutoshi Fujii (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor device capable of lowering the temperature of the entire joining process to room temperature, a method for manufacturing a semiconductor device, and an electronic device. The semiconductor device includes: a first insulating film; a plurality of first joining electrodes formed on a surface of the first insula...