US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on June 23 for "Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,746, issued on June 23, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus" was invented by Tatsumasa Hiratsuka (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a solid-state imaging device, a manufacturing method of a solid-state imaging device, and an electronic apparatus that are capable of reducing tensile stress produced between a covering film and a semiconductor element which is joined to a solid-state imaging element and which is covered with the covering film, and that allow tran...