US Patent Issued to Sony Semiconductor Solutions on July 28 for "Semiconductor apparatus and method for manufacturing semiconductor apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,569, issued on July 28, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor apparatus and method for manufacturing semiconductor apparatus" was invented by Naoto Sasaki (Nagasaki, Japan), Kenichi Saitou (Nagasaki, Japan), Yusuke Hayashi (Nagasaki, Japan), Atsuhiko Yamada (Nagasaki, Japan), Takushi Shigetoshi (Kanagawa, Japan) and Takuya Ooi (Nagasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A parasitic capacitance of a wiring arranged on a back surface side of a semiconductor substrate is reduced. A semiconductor apparatus includes a semiconductor substrate, a back surface side wiring, a through wiring, ...