US Patent Issued to Sony Semiconductor Solutions on July 28 for "Imaging device and method of manufacturing imaging device" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,694, issued on July 28, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Imaging device and method of manufacturing imaging device" was invented by Masaki Haneda (Kanagawa, Japan), Takatoshi Kameshima (Kanagawa, Japan), Ikue Mizuno (Kanagawa, Japan), Takeya Mochizuki (Kanagawa, Japan), Takuya Masunaga (Kanagawa, Japan) and Shogo Otani (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An imaging device according to an embodiment of the present disclosure includes: a first wiring layer; a first insulating film; a second insulating film; and a first electrically conducive film. The first wiring layer includes a plura...