US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on July 14 for "Solid-state imaging device and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,878, issued on July 14, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Solid-state imaging device and method for manufacturing the same" was invented by Rena Kagawa (Kanagawa, Japan), Shunsuke Maruyama (Kanagawa, Japan), Hiroaki Matsuo (Kanagawa, Japan) and Ryosuke Suenaga (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a solid-state imaging device including a first substrate that performs photoelectric conversion and a second substrate that reads photoelectric-converted photocurrent, the first substrate and the second substrate being stacked. The first substrate includes a photoelectric conversion...