US Patent Issued to Sony Semiconductor Solutions on Aug. 4 for "Solid-state imaging device" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,807, issued on Aug. 4, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging device" was invented by Takuya Kurihara (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a solid-state imaging device capable of forming a pixel separation groove having a suitable action in a substrate.A solid-state imaging device of the present disclosure includes: a first photoelectric conversion unit and a second photoelectric conversion unit that are provided in a first semiconductor substrate and are adjacent to each other; a first pixel separation groove provided between the first photoelectric conversion...