US Patent Issued to Sony Semiconductor Solutions on Aug. 4 for "Solid-state imaging device, method of producing the same, and electronic apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,808, issued on Aug. 4, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging device, method of producing the same, and electronic apparatus" was invented by Kengo Kotoo (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electrical connection between mutually facing electrodes is provided. A solid-state imaging device includes: a first semiconductor base; a second semiconductor base bonded to the first semiconductor base; and a conductive polymer, the first semiconductor base including a first semiconductor layer in which a photoelectric conversion unit is provided, a first multilayer wiring layer stac...