ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,813, issued on Aug. 4, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).
"Semiconductor package" was invented by Shun Mitarai (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package further reduced in size. A semiconductor package, including a mounting substrate; a semiconductor chip having a smaller area than the mounting substrate and mounted on a main surface of the mounting substrate; a sealing glass facing the semiconductor chip and the mounting substrate, connected to the mounting substrate by a substrate connection part, and connected to the semiconductor chip by a chip connection...