US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Semiconductor device with blocks including units with a protection element and a bump connected to a main unit" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,748, issued on Aug. 11, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor device with blocks including units with a protection element and a bump connected to a main unit" was invented by Akihiko Murashima (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a semiconductor device capable of reducing design load.Provided is a semiconductor device including: a first substrate; and a second substrate bonded to the first substrate with a bonding portion where a bump is bonded, in which the bump pairs up with a predetermined function to constitute a unit. The present disclosu...