ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,749, issued on Aug. 11, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).
"Semiconductor device and imaging device" was invented by Katsunori Tozawa (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present technology relates to a semiconductor device and an imaging device capable of efficiently dissipating heat generated in a semiconductor package including a resin. A first substrate, a second substrate, a wiring layer that is located between the first substrate and the second substrate, and a slit that penetrates the first substrate and reaches the wiring layer are provided. The gap is provided for each wiring...