ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,741, issued on Aug. 11, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).
"Imaging element and semiconductor chip" was invented by Hitoshi Okano (Kanagawa, Japan) and Kan Shimizu (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present technology relates to an imaging element and a semiconductor chip that can implement a low height of the imaging element. A first chip including a photo diode; and a second chip including a circuit processing a signal transmitted from the photo diode are stacked, and a charging film is disposed on a second face of the second chip that is on a side opposite to a first face on whic...