US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on April 7 for "Solid-state imaging element and manufacturing method thereof" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,830, issued on April 7, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Solid-state imaging element and manufacturing method thereof" was invented by Shinichi Yoshida (Kanagawa, Japan) and Ryoji Hasumi (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a solid-state imaging element that includes a substrate, a plurality of photoelectric conversion units that is provided in the substrate, and a first insulation film that is provided between the plurality of photoelectric conversion units adjacent to each other among the plurality of photoelectric conversion units, and has a fixed charge provided on an i...