US Patent Issued to Sony Semiconductor Solutions on April 7 for "Solid-state imaging device and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,827, issued on April 7, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging device and manufacturing method therefor" was invented by Nobutoshi Fujii (Kanagawa, Japan), Suguru Saito (Kanagawa, Japan) and Takashi Fukatani (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present feature relates to a solid-state imaging device that allows generation of flare to be reduced and a manufacturing method therefor. A solid-state imaging device according to the present feature includes a semiconductor substrate having a pixel area having a plurality of pixels provided therein, and a transparent structur...