US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on April 21 for "Semiconductor chip and manufacturing method therefor" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,760, issued on April 21, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor chip and manufacturing method therefor" was invented by Shogo Ono (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a semiconductor chip that allows electrical connections to be protected and a manufacturing method therefor.A semiconductor chip has a strip-shaped region including a plurality of recesses on a side surface thereof. The recesses are arranged in a matrix of rows and columns on the side surface of the semiconductor chip or in a zig-zag pattern in the region. At least two of the str...