US Patent Issued to SONY GROUP on Sept. 8 for "Semiconductor device, electronic device, and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,285, issued on Sept. 8, was assigned to SONY GROUP Corp. (Tokyo).

"Semiconductor device, electronic device, and method for manufacturing semiconductor device" was invented by Yoshiaki Yanagawa (Kanagawa, Japan) and Takushi Shigetoshi (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor device capable of constituting a through electrode having a desired shape, an electronic device, and a method for manufacturing a semiconductor device. The semiconductor device includes a first substrate including silicon, a first film formed on at least some surfaces of a hole-shaped portion formed in the first substrate, and a...