ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,983, issued on June 23, was assigned to Sony Group Corp. (Tokyo).
"Semiconductor device" was invented by Koichi Ono (Kanagawa, Japan) and Mika Kotanagi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Reliability is improved in a semiconductor device. The semiconductor device includes a wiring layer, a semiconductor chip stacked in a predetermined region on a wiring surface of the wiring layer, and a signal line that is wired on the wiring surface and has an angle less than a predetermined angle in at least one of two regions divided by any boundary line of the predetermined region, the angle being formed when the signal line crosses the bounda...