ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,406, issued on April 14, was assigned to SONY GROUP Corp. (Tokyo).
"Multilayer electronic substrate" was invented by Kanahiro Shirota (Tokyo) and Keiichi Hirano (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a multilayer electronic substrate that includes a first substrate, a second substrate placed on the first substrate such that surfaces of the first and second substrates face each other, a first connector mounted on the surface of the first substrate and electrically connected to a first wire of the first substrate, a second connector mounted on the surface of the second substrate and electrically connected to a first wire of...