US Patent Issued to Sony Group, Sony Semiconductor Solutions on Oct. 27 for "Cooling mechanism having nanocapillary structure, semiconductor device provided with cooling mechanism, method for manufacturing same, and electronic device" (British, Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,932, issued on Oct. 27, was assigned to Sony Group Corp. (Tokyo) and Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Cooling mechanism having nanocapillary structure, semiconductor device provided with cooling mechanism, method for manufacturing same, and electronic device" was invented by Hikaru Ohira (Kanagawa, Japan), Yoichiro Fujinaga (Kanagawa, Japan), Christopher Wright (London), Jan Jasper Van Den Berg (London) and Matthew Lawrenson (London).

According to the abstract* released by the U.S. Patent & Trademark Office: "Conventional problems are solved by providing a cooling mechanism having a nanocapillary structure constituted by graphene, a semiconductor device incl...