US Patent Issued to SOLUS ADVANCED MATERIALS on July 28 for "High temperature stability epoxy resin composition and encapsulation material comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,410, issued on July 28, was assigned to SOLUS ADVANCED MATERIALS Co. LTD. (Iksan, South Korea).

"High temperature stability epoxy resin composition and encapsulation material comprising the same" was invented by Hongsuk Kim (Yongin, South Korea) and Jongtae Lim (Yongin, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Proposed are an epoxy resin composition having high-temperature stability and an encapsulant including the same. The composition can be applied to various gap filling methods in which a low-viscosity liquid is injected into a gap through ink jetting or dispensing and then the liquid is cured. The composition has high adhesive...