US Patent Issued to Skyworks Solutions on Oct. 27 for "Multi chip front end module with shielding vias" (Canadian Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,943, issued on Oct. 27, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Multi chip front end module with shielding vias" was invented by Abdulhadi Ebrahim Abdulhadi (Kanata, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency front end module is provided which includes a first filter module disposed on a substrate, a second filter module disposed on the substrate, a resin casing disposed on the substrate and encapsulating the first and second filter modules, and a radio frequency shield disposed between the first and second filter module, wherein the shield comprises a plurality of vias formed in the resin casing and e...