US Patent Issued to Skyworks Solutions on May 12 for "Surface acoustic wave device comprising multi-layer interdigital transducer electrode" (American, Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,627,278, issued on May 12, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Surface acoustic wave device comprising multi-layer interdigital transducer electrode" was invented by Kezia Cheng (Lowell, Mass.), Alan Sangone Chen (Leesburg, Fla.), Benjamin Paul Abbott (Irvine, Calif.), Rei Goto (Osaka, Japan), Yosuke Hamaoka (Suita, Japan) and Michael David Hill (Emmitsburg, Md.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface acoustic wave device includes a piezoelectric substrate and a multi-layer interdigital transducer electrode disposed on the piezoelectric substrate. The multi-layer interdigital transducer electrode includes a first e...