US Patent Issued to Skyworks Solutions on March 31 for "Heat transfer from non-groundable electronic components" (California Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,394, issued on March 31, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Heat transfer from non-groundable electronic components" was invented by Bhuvaneshwaran Vijayakumar (Irvine, Calif.), Robert Francis Darveaux (Corona Del Mar, Calif.) and Lori Ann DeOrio (Irvine, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided. The electronic package comprises an electronic component, a substrate, a ground plane, a thermally conductive pathway and at least one thermally conductive member. The ground plane is enclosed in or supported by the substrate. The electronic component includes a non-groundable thermal o...