US Patent Issued to Skyworks Solutions on March 24 for "Dual sided molded package with varying interconnect pad sizes and varying exposed solderable area" (California Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,555, issued on March 24, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Dual sided molded package with varying interconnect pad sizes and varying exposed solderable area" was invented by Howard E. Chen (Anaheim, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A dual sided molded package has a substrate with pads of varying size configured to receive electrically conductive interconnect members thereon. The pads include first pads that have a larger surface area than a surface area of second pads. In one implementation, one or more first pads are proximate the corners of the substrate. First interconnect members are attached to the...