US Patent Issued to Skyworks Solutions on March 17 for "Configurations for metal posts for dual side mold modules" (California Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,013, issued on March 17, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Configurations for metal posts for dual side mold modules" was invented by Howard E. Chen (Anaheim, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged module can include a packaging substrate with first and sides, first and second components mounted on the first and second sides, respectively, and first and second overmolds implemented on the first and second sides, respectively, with the second overmold defining a mounting surface. The packaged module can further include a plurality of conductive features implemented on the second side of the packagin...