US Patent Issued to Skyworks Solutions on July 14 for "Packaged acoustic wave devices with multi-layer piezoelectric substrate with seal ring spaced from piezoelectric layers" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,577, issued on July 14, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Packaged acoustic wave devices with multi-layer piezoelectric substrate with seal ring spaced from piezoelectric layers" was invented by Rei Goto (Osaka, Japan), Hironori Fukuhara (Ibaraki, Japan) and Takuya Ushiyama (Moriguchi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged acoustic wave component has two acoustic wave devices interconnected by a thermally conductive frame, at least one of the acoustic wave devices including a multi-layer piezoelectric substrate. The multi-layer piezoelectric substrate includes a support layer and a piezoelectric lay...