US Patent Issued to Skyworks Solutions on Feb. 24 for "Wafer level package having enhanced thermal dissipation" (North Carolina Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,711, issued on Feb. 24, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Wafer level package having enhanced thermal dissipation" was invented by Joshua James Caron (Summerfield, N.C.) and Eesa Rahimi (Greensboro, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface acoustic wave device including a piezoelectric layer, an interdigital transducer electrode over the piezoelectric layer, and a polymeric roof layer arranged over the piezoelectric layer and interdigital transducer electrode. The polymeric roof layer is spaced apart from the piezoelectric layer to define a cavity to accommodate the interdigital transducer electrode. The...