US Patent Issued to Skyworks Solutions on Aug. 25 for "Bulk acoustic wave device packaging with redistribution using silicon dioxide insulation" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,719,440, issued on Aug. 25, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Bulk acoustic wave device packaging with redistribution using silicon dioxide insulation" was invented by Atsushi Takano (Kadoma, Japan), Mitsuhiro Furukawa (Nishinomiya, Japan) and Yusuke Horiguchi (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device package comprises an electrical device disposed on a base substrate, a conductive column in electrical communication with the electrical device and having a first end bonded to the base substrate, a cap substrate disposed over the electrical device and bonded to a second end of the conductive...