US Patent Issued to Skyworks Solutions on April 14 for "Integrated device package with reduced thickness" (California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,446, issued on April 14, was assigned to Skyworks Solutions Inc. (Irvine, Calif.).

"Integrated device package with reduced thickness" was invented by Anthony James LoBianco (Irvine, Calif.), Hoang Mong Nguyen (Irvine, Calif.) and Yi Liu (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device package is disclosed. The integrated device package can include a carrier, an electronic component mounted on the carrier, a molding material disposed over the carrier, and an electromagnetic interference shield layer disposed over the molding material. The electronic component is at least partially disposed in the molding material. At le...