US Patent Issued to Skyworks Global on June 9 for "Piezoelectric MEMS device with thermal compensation from one or more compensation layers" (Japanese, South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,649,653, issued on June 9, was assigned to Skyworks Global Pte. Ltd. (Singapore).

"Piezoelectric MEMS device with thermal compensation from one or more compensation layers" was invented by Siarhei Dmitrievich Barsukou (Takarazuka, Japan), Myeong Gweon Gu (Seoul, South Korea) and Hiroyuki Nakamura (Osaka-Fu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system for compensating for thermal stress in piezoelectric microelectromechanical systems devices can have a piezoelectric layer at least partially spanning a cavity such that it generates electrical signals when external forces cause the piezoelectric layer to vibrate with respect to the cavity....