US Patent Issued to SKY TECH on June 2 for "Bonding machine with horizontal correction function and horizontal correction method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,301, issued on June 2, was assigned to SKY TECH INC. (Hsinchu County, Taiwan).

"Bonding machine with horizontal correction function and horizontal correction method thereof" was invented by Jing-Cheng Lin (Hsinchu County, Taiwan), Jung-Hua Chang (Hsinchu County, Taiwan) and Mao-Chan Chang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding machine with horizontal correction function includes a first chamber, a second chamber, a pressing unit, a carrier, a plurality of level adjustment units, and a plurality of distance measuring units. The first chamber is configured to be connected to the second chamber to define an encl...