US Patent Issued to SK SPECIALTY, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS on April 14 for "Substrate processing method and selective deposition method using the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,047, issued on April 14, was assigned to SK SPECIALTY Co. LTD. (Yeongju-si, South Korea) and INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS (Ansan, South Korea).

"Substrate processing method and selective deposition method using the same" was invented by SungWoong Chung (Sejong-si, South Korea), Junghun Kawk (Sejong-si, South Korea), Jihun Lee (Sejong-si, South Korea), Woohee Kim (Ansan-si, South Korea), Jeongmin Lee (Ansan-si, South Korea) and Seohyun Lee (Ansan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a substrate processing method. The method includes providing a substrate having...