US Patent Issued to SK hynix on Oct. 27 for "Stack package including insert die for reinforcement" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,936, issued on Oct. 27, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Stack package including insert die for reinforcement" was invented by Jin Woong Kim (Icheon-si, South Korea) and Jong Yeon Kim (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stack package includes a first die stack including first dies, a second die stack including second dies, and an insert die between the first die stack and the second die stack, wherein the insert die is thicker than each of the first and second dies."

The patent was filed on March 20, 2023, under Application No. 18/186,274.

*For further information, including images, char...