US Patent Issued to SK hynix on March 24 for "Semiconductor device including bonding pads and method for fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,565, issued on March 24, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).

"Semiconductor device including bonding pads and method for fabricating the same" was invented by Byung Ho Lee (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a first semiconductor structure including a stacked structure of a first dielectric layer and a first bonding dielectric layer; a second semiconductor structure including a stacked structure of a second dielectric layer and a second bonding dielectric layer; and a bonding pad penetrating the stacked structure of the first dielectric layer and the first b...