US Patent Issued to SK hynix on March 17 for "Substrate having a die position mark and a semiconductor die stack structure including semiconductor dies stacked on the substrate" (South Korean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,961, issued on March 17, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Substrate having a die position mark and a semiconductor die stack structure including semiconductor dies stacked on the substrate" was invented by Bok Gyu Min (Icheon-si, South Korea) and Beom Sang Cho (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate includes: a first die alignment mark and a first die position mark defining a die stack region. The first die alignment mark has substantially a cross shape having substantially a vertical bar and substantially a horizontal bar intersecting each other substantially perpendicularly, and t...