US Patent Issued to SK hynix on June 9 for "Memory package and memory module including the memory package" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,808, issued on June 9, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).

"Memory package and memory module including the memory package" was invented by Won Ha Choi (Gyeonggi-do, South Korea), Han Suk Ko (Gyeonggi-do, South Korea) and Uksong Kang (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A single memory package includes: a substrate; and a memory chip and a buffer chip that are integrated over the substrate, wherein the memory chip includes an interface modulator embedded therein, and the interface modulator is a serializing modulator including a multi-level amplitude modulator."

The patent was filed on Feb. 13...