US Patent Issued to SK hynix on June 30 for "Method of manufacturing semiconductor package using double adhesive layers" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,580, issued on June 30, was assigned to SK hynix Inc. (Icheon-si, South Korea).

"Method of manufacturing semiconductor package using double adhesive layers" was invented by Mina Park (Icheon-si, South Korea) and Minsuk Kim (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "First and second layers of different adhesive materials are laminated to a carrier such that the second adhesive layer is attached to the carrier. The first adhesive layer is cured first. A semiconductor die is then placed on the cured first adhesive layer. An encapsulant layer is formed over at least a portion of the cured first adhesive layer while encapsulat...