US Patent Issued to SK HYNIX on July 21 for "Image sensing device including multi-thickness substrate" (South Korean Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,284, issued on July 21, was assigned to SK HYNIX INC. (Icheon-si, South Korea).

"Image sensing device including multi-thickness substrate" was invented by Dong Ha Kim (Icheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensing device includes a semiconductor substrate including photoelectric conversion regions that correspond to unit pixels, respectively, each photoelectric conversion region generating photocharges through conversion of incident light, and a plurality of first color filters disposed over a first surface of the semiconductor substrate to transmit incident light of a first color to the photoelectric convers...