ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,691, issued on Aug. 4, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).
"Semiconductor device and method for fabricating the same" was invented by Seung Hwan Kim (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a plurality of word line pad portions that are stacked over a lower structure in a direction perpendicular to a surface of the lower structure; horizontal-level dielectric layers between the word line pad portions; and bridge prevention layers disposed between the word line pad portions and covering ends of the horizontal-level dielectric layers."
The patent was filed on Nov. 1...