US Patent Issued to SK hynix on Aug. 25 for "Semiconductor package having memory devices stacked in staircase" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,232, issued on Aug. 25, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).

"Semiconductor package having memory devices stacked in staircase" was invented by Byung Deuk Jeon (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate having bond fingers; a master memory chip mounted on the substrate; and a slave memory chip stacked over the master memory chip. The master memory chip includes master external pads and master internal pads disposed adjacent to a first side edge of the master memory chip; and master power pads disposed adjacent to a second side edge of the master memory ch...